西安天光半导体有限公司成立于2015年，隶属陕西电子信息集团有限公司，注册资本4000万元，为陕西省高新技术企业。公司注册地址西安市西安半导体产业园，厂房面积为6000余平方米，主要从事集成电路芯片设计、晶圆制造、封装、检测、产品销售等全产业链服务。
目前，公司主要产品有FPGA、ID card、DC/DC电源模块、AC/DC电源模块、数字隔离器、霍尔电流传感器、霍尔开关、电源管理芯片、存储器（SRAM、SDRAM、DDR）、运算放大器、54系列数字电路、74系列数字电路、MOS管、TVS管、二极管、三极管等产品。产品等级为工业级(-40°C~+85°C) 、汽车级(-40°C~+105°C)、超工业级(-40°C/-55°C~+125°C)。
公司产品的封装种类有陶瓷封装、金属封装、塑料封装，主要封装形式为DIP、SOP、CFP、QFP、QFN、LCC、DFN等。
产品主要应用于通讯、汽车、安防、智能终端、白色家电、医疗设备等高可靠领域。
Xi’an Tianguang Semiconductor Co., Ltd. was established in 2015 and is affiliated to Shaanxi Electronic Information Group with a registered capital of 40 million yuan. It is a high-tech enterprise in Shaanxi Province. The company’s registered address is in Xi’an Semiconductor Industrial Park in Xi’an City, with a plant area of more than 6,000 square meters. It is mainly engaged in the full industrial chain services such as integrated circuit chip design, wafer fabrication packaging, testing, and product sales.
At present, the company’s main products include FPGA, ID card, DC/DC power module, AC/DC power module, digital isolator, Hall current sensor, Hall switch, power management chip, memory (SRAM, SDRAM, DDR), operational amplifier, 54-series digital circuit, 74-series digital circuit, MOSFET, TVS , diode, transistor and other products. The product grades are industrial grade (-40°C ~ +85°C), automotive grade (-40°C ~ +105°C), and super industrial grade (-40°C / -55°C ~ +125°C).
The packaging types of the company’s products include ceramic packaging, metal packaging, and Plastical packaging. The main packaging forms are DIP, SOP, CFP, QFP, QFN, LCC, DFN, etc.
The products are mainly applied in high-reliability fields such as communication, automobiles, security, intelligent terminals, white goods, and medical equipment.
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联系地址：西安市高新区锦业路125号半导体产业园E3楼
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联系电话：029-81110871
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